- Spin and spray coating of photoresist
- Dry film photoresist lamination
- Dispensing of photoresist
- Electrodeposition of photoresist

- Exposure with double side alignment

- Si, SiO2, SiN LPCVD and PECVD
- Sputtering and E-beam evaporation
- Au and AuSn electroplating
- Parylene coating
- Hot roll and vacuum lamination

- Si DRIE, RIE and plasma etching
- Si KOH, TMAH, Vapor HF etching
- Metal wet etching
- Si plasma dicing
- Polymer surface modification

- Selective laser micromachining
- High speed laser drilling
- UV laser marking

- Atmospheric plasma etch
- SEM / EDS analysis